Technical services

6 technologies by insidix

With almost 25 years of experience in the field of Non Destructive Testing and the diversity of the technologies available in its lab, INSIDIX provides a quick, reliable and precise expertise.

Advanced imaging

INSIDIX lab provides its expertise on different topics :

  • Failure analysis (FA) : defects detection, identification and analysis of the root cause.
  • Qualification – Fiability : comparison before and after tests (endurance,…).
  • Production control
  • Control in accordance with standards : IPC A610, Mil-Std883, J-Std-035, Esa, IPC 7025, etc
  • Parts Screening
Our equipments

INSIDIX lab uses :

  • Acoustic microscopes (C-SAM)
  • X Ray Radiography systems (2D)
  • X Ray Tomography systems (3D)
  • Lock in thermography (IR – LIT)
  • Topography and Deformation measurement (TDM)
  • X-Ray Micro-fluorescence  (XRF)

Lock-In Thermography - LIT

Infrared thermography can assist in understanding material heterogeneities, characterize heat dissipation or spreading, or electrical failures localization (short circuit or leakage).

Analyses done under thermal, electrical, magnetic (RFID) load.

With Dynamic or lock-in Infrared Thermography (LIT),sensitivity is increased and « hot spot » of some 10-3 °C are detected.       Heat dissipation: observation of a full board or system, temperature mapping and measurement, visualization of hot components or areas. Comparison with spec. or models

–         Leakage and Short-circuit source (incl. CAF) localization, very fast and accurate (up to 6µm): in only few hours a hot spot is detected and allows to guaranty defect finding ( current compliance ensure no burning , localization data are transmitted for deprocessing ).

Applications :

  • Fast localization of leakage, short-circuit
  • Heat spreading efficiency, heat dissipation
  • Thermal homogeneity
  • Check specification, check design, or model
  • Sealing joints
  • Brazed and welded joints
  • Qualification and fast selection of glues, adhesive, comparative analyses of aging, etc
  • Inclusions, heterogeneities, porosities, cracks in material

X-ray radiography

Radiography is one of the oldest and most widely used methods of non-destructive testing. Radiography uses radiation energy to penetrate solid objects in order to assess variations in thickness or density, and for instance to detect cracks or other internal imperfections. The test object is placed between the radiation source and a digital detector. The image on the detector show the internal features of the test object.

Conventional 2D radiography is a shadowgraph of a 3D object, and information in depths and volume can be obtained observing the object with several orientations (angle).

Radiography can be used to inspect almost any material for defects, and can also be used to locate internal features, confirm the location of hidden parts in an assembly and to measure thickness of materials.

Applications :

  • Fast production control
  • Standards : IPC A610, Mil-Std883, Esa, etc
  • Parts sorting
  • Brazing and solder pads quality (porosity, surface rate)
  • Inspection of solder joints for electronic components through and SMT (BGA, QFN, QFP, capacitors, resistance, coils…)
  • Contacts (on/off), connectors
  • Check design & assembly
  • Inclusions, heterogeneities, porosities, cracks in material (eg. ceramic)

3D Computed Tomography

Computerized Tomography (CT) improves upon conventional 2D radiography by producing 3D cross-sectional images of an object from flat x-ray images. In a CT system, the test component is placed upon a turntable stage that is between the radiation source and an imaging system. The sample is rotated during the examination, and the digital detector registers thousands of individual 2D x-ray images from all angles. An algorithm reconstructs the inner-structural image processing the data into a complete 3D representation. The characteristics of the internal structure of an object including dimensions, shape, defects, and density are readily available from the whole volume obtained.  

Scannig accoustic microscopy

Acoustic microscopy (SAM) is a non-invasive & non-destructive technique that can be used to image the internal features of a specimen, in particular its interfaces. SAM is a superior tool to detect delaminations even of sub-micron thicknesses (down to 100nm !). SAM is particularly useful for inspection of small or complex optical devices, electronic devices. SAM can also be used to measure the thickness of an internal layer of material.  Overall, SAM is an efficient tool for evaluating sealing quality, printed circuit boards, underfills, BGA, QFN, passive components, and wafers.


SAM systems use sound energy to image a sample through the use of transducers. Samples are submerged in a liquid medium to ensure the ultrasound waves propagate to and through the samples. The ultrasonic transducers send pulses into the liquid. The transducer also receives reflected pulses (echoes) from discontinuities and disturbances from the sample. The transducer transforms the reflected sound pulses into electromagnetic pulses which are displayed as pixels with defined gray values thereby creating an image.

A complementary imaging technology is acoustic Tomographiy (SALI). It allows to slice a sample into as many as 100 images using a single scan. The image data set allows to investigate different interfaces.


Applications :

  • Fast production control
  • Standards : IPC A610, Mil-Std883, J-Std-035, Esa, etc
  • Parts sorting
  • Inspection of solder pads, flip-chip, underfill, die-attach
  • Sealing joints
  • Brazed and welded joints
  • Qualification and fast selection of glues, adhesive, comparative analyses of aging, etc
  • Inclusions, heterogeneities, porosities, cracks in material

Topography and deformation measurement

TDM (Topography and Deformation Measurement) is a patented technology designed to the 3D measurements of complex objects under thermal stress. TDM exerts thermal profiles and cycles on electronics components, in the same way as they are imposed on devices during production processes.

Understanding, simulating and predicting the behaviour of complex packages and board during reflow is key.

TDM helps the development and process engineer to increase the reliability of his products, from simple components to highly complex packaging, and allows the failure analysis engineer to understand more accurately the root causes of failures observed in operations.

The TDM operating system combines a powerful, internally developed heating/cooling sequence with a sophisticated optical set-up for 3D topography analysis under thermal stress of all kinds of materials, components and sub-systems. TDM can impose the same thermal profiles and cycles on the devices that they will actually experience during the production process and during normal use. Throughout the thermal cycle, TDM measures the 3D deformation related to the imposed thermal stress, thus revealing faults that would likely occur during normal production and use.

Thanks to its innovative technology and unique features, TDM system has been chosen by major companies in the field of electronics and semi-conductors for both quality control and R&D purposes. TDM equipment is compatible with any existing topography tool on the market and therefore can be easily integrated into all types of equipment park.Our customers acknowledged the technical advantages of the TDM system such as the high resolution sensor, the versatility of the system and its user friendliness that lead to a very high throughput.