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INSIDIX TDM

TDM - IC

TDM – IC is the ideal topography and deformation analysis system for warpage analysis on components (ICs, sockets, connectors) and small assemblies.
As table top instrument it easily integrates into any laboratory environment. Nevertheless, its state of the art heating, cooling and imaging performance allow for fast and easy validation of component warpage in compliance with all relevant industry standards. Typical applications include component qualification for reflow temperature profile compatibility, curing process optimization, material properties analysis (coefficient of thermal expansion), or small PCB failure risk analysis.
TDM-IC is compliant to the thermal stress generation requirements of the JEDEC 22B112A and IPC/JEDEC J-STD-020D standards.
> Temperature range: 25°C … 260°C
> Maximum temperature gradients: Heating up to +3°C/s; Cooling down to -6°C/s
> Temperature homogeneity: +/- 5°C within a 75 × 75 mm heated area
> Sample size range: 10 × 10 mm … 100 × 100 mm
> Analysis modes: Topography z(x,y), Out-of-plane deformation z(x,y), In-plane deformation x(x,y), y(x,y)
> “Operator mode” integrated in the user software, for secure single button operation

TDM - Compact

TDM - Compact is a versatile instrument for a wide panel of applications in the domains of process development, reliability improvement, failure analysis and quality control.
Equipped with zoom optics, its field of view easily adjusts to the exact size of the component or assembly under study.  Combined with its high resolution CCD camera, lateral resolutions of down to 15 × 15 µm can be obtained, allowing for sharp imaging of even tiny structures.
TDM-compact exceeds the thermal stress generation requirements defined in the JEDEC 22B112A and IPC/JEDEC J-STD-020D standards. An optional sub room-temperature cooling module is available.
> Available temperature range: -60°C … 300°C
> Maximum temperature gradients: Heating up to +3°C/s; Cooling down to -6°C/s
> Temperature homogeneity: +/-5°C within a 150 × 150 mm heated area
> Sample size range: 5 × 5 mm … 300 × 300 mm (max. 200 × 200 mm for sub room-temperature cooling)
> Analysis modes: Topography z(x,y), Out-of-plane deformation z(x,y), In-plane deformation x(x,y), y(x,y)
> 4 MPixel CCD camera

 

 

TDM - HR

TDM – HR is the TDM system allowing for the largest sample size, up to 400 × 400 mm (and larger, on request). Combined with the optionally available extended heating zone, it is our most versatile instrument for out-of-plane and in-plane warpage and deformation analysis on samples ranging from tiny components to full size equipped boards and assemblies.
 > Available temperature range: -60°C … 300°C
> Maximum temperature gradients: Heating up to +3°C/s; Cooling down to -6°C/s
> Temperature homogeneity: +/-5°C within a 150 × 150 mm heated area
> Optionally extended heating zone available: +/-5°C within a 400 × 400 mm heated area
> Sample size range: 5 × 5 mm … 400 × 400 mm (max. 200 × 200 mm for sub room-temperature cooling)
> Analysis modes: Topography z(x,y), Out-of-plane deformation z(x,y), In-plane deformation x(x,y), y(x,y). 
 

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