TDM - Compact
TDM - Compact is a versatile instrument for a wide panel of applications in the domains of process development, reliability improvement, failure analysis and quality control.
Equipped with zoom optics, its field of view easily adjusts to the exact size of the component or assembly under study. Combined with its high resolution CCD camera, lateral resolutions of down to 15 × 15 µm can be obtained, allowing for sharp imaging of even tiny structures.
TDM-compact exceeds the thermal stress generation requirements defined in the JEDEC 22B112A and IPC/JEDEC J-STD-020D standards. An optional sub room-temperature cooling module is available.
> Available temperature range: -60°C … 300°C
> Maximum temperature gradients: Heating up to +3°C/s; Cooling down to -6°C/s
> Temperature homogeneity: +/-5°C within a 150 × 150 mm heated area
> Sample size range: 5 × 5 mm … 300 × 300 mm (max. 200 × 200 mm for sub room-temperature cooling)
> Analysis modes: Topography z(x,y), Out-of-plane deformation z(x,y), In-plane deformation x(x,y), y(x,y)
> 4 MPixel CCD camera