- SONIX Echo Brochure
- SONIX Echo Specification
- SONIX Wafer Capability Brochure
- Hardware option - Simultaneous Pulse-Echo Through Transmission_PETT
- Software option - Stacked Die Imaging
- Software option - Molded Flip Chip Imaging
- Software option - Iceberg - advanced diagnostic Package analysis
- Software option - advanced diagnostic Flexible TAMI
SONIX
ECHO™
Sonix™ ECHO can detect defects as small as 0.05 micron and is an excellent tool for bump detection, stacked die (3D Packaging) inspection, complex flipchip inspection and more traditional plastic packages.
ECHO VS™
Designed to provide industry leading defect identification capability and image quality.
The ECHO VS comes standard with the Image Enhancement suite which includes Heated Water, Flexible TAMI, WinIC Pro, MFCI™ and Waveform Averaging. This tool is ideal for advanced packaging, including molded flip chip, stacked die, TSV, Cu Pillar and more.
ECHO PRO™
This is a revolutionary, robust design that benefits high throughput needs of production customers. The ECHO-PRO is an automated tool designed for production applications with high volume and low mix. Using the reputable and reliable ECHO scanner as the base system, Sonix™ incorporated industry standard SMEMA input and output handlers to this tool. Additionally, the tool is equipped with a pick and place gantry which optimizes part handling and decreases drying time.
AutoWafer PRO™
The AutoWafer Pro is a flexible, automated wafer tool designed for production. This tool can help achieve rapid ramp to yield improvement, faster release to production, minimize yield loss due to process failure and more. It is capable of handling 200mm or 300mm wafers. The tool is able to utilize open cassettes, FOUPs or FOSB handling and it is Class I Clean Room compliant, containing an integrated HEPA filter.