Exhibit News
08/03/12
IMAPS journée technique: Fiabilité des composants et systèmes
IMAPS Technical Exhibition day
Journée technique « la Fiabilité du packaging des semiconducteurs »
Bordeaux
November 13-17th
ISTFA 2011
The ISTFA technical symposia, user groups, education opportunities and the largest equipment exposition in the industry.
San Jose, California (USA)
October 20-21th
GIF Innovation 2011
For its third edition Grenoble Innovation Fair is broadening its scope to cover more new or emerging innovations in Europe.
Grenoble (FRANCE)
October 16-20th
SMTA International 2011
The Surface Mount Technology Association, developing solutions in Electronics Assembly
Fort Worth TX (USA)
October 3-6th
IWLPC 2011
International Wafer-Level Packaging Conference
Santa Clara CA (USA)
October 3-7th
Esref 2011
This international symposium continues to focus on recent developments and future directions in Quality and Reliability Management of materials.
Bordeaux (FRANCE)
July 12-14th
Semicon West 2011
Semicon West is your opportunity to connect with your customers, demonstrate your market leadership, and develop partnerships.
San Francisco (USA)
July 4-7th
IPFA 2011
IPFA 2011 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures.
South Korea
May 31st- June 3rd
ECTC 2011
Electronic Components and Technology Conference
Orlando FL (USA)
May 24-27th
Cofrend's days
Confédération Française pour les Essais Non Destructifs
Dunkerque (France)
May 11-13th
Semicon Singapore 2011
SEMICON Singapore is a series of informative forums simultaneously taking place right at the show floor where visitors can meet the industry leaders.
Singapore
May 11-12th
Minapad 2011
Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum
Grenoble
May 3rd
Imaps New England Packaging Symposium 2011
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems
Boxborough MA( USA)
May 3-5th
SMT/Hybrid/Packaging 2011
System Integration in Micro Electronics
Nuremberg (Germany)
April 17-20th
Eurosime 2011
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Linz (Austria)
April 10-14th
IPC-APEX 2011
Advanced and Emerging technologies in printed board design and manufacturing, electronics assembly and test
Las Vegas (USA)
April 6-7th
Decielec 2011
Convention d'affaires des systèmes embarqués Congrès international de l'électronique de puissance et du management des systèmes énergétiques
Tarbes (France)
March 8-10th
Imaps conference on DEVICE PACKAGING
7th International Conferrence and Exhibition on device Packaging
Fountain Hills (AZ, USA)
February 2-3rd
Imaps Micropackaging and Thermal MANAGEMENT 2011
This event has consistently attracted more presenters and delegates over the years. This is a real networking opportunity on thermal management of integrated circuits and electronic systems in Europe.
La Rochelle (France)
Exhibit News
> Mar 08 2012