Exhibit News
09/09/2013 - 12/09/2013
EMPC 2013
European Microelectronics and Packaging Conference - Paper "Coupling experimental and modelling results for device failure anticipation"- Booth
Grenoble FRANCE
28/05/2013 - 31/05/2012
ECTC 2013 Electronic Components and Technology Conference
Las Vegas NV USA
February 6 & 7, 2013
IMAPS 2013
8th European Advanced Technology Workshop on Micropackaging and Thermal management
La Rochelle France
05/12/2012 to 07/12/2012
SEMICON Japan
The World Largest Exhibition for The Semiconductor Manufacturing Supply Chain
Tokyo (JAPAN)
Nov 28_29 2012
15th Technical & Scientific Meeting of ARCIS
Characterization methods for Microelectronics and Photovoltaics
Gardanne - France
11/11/2012 to 15/11/2012
ISTFA 2012
38th International Symposium for Testing and Failure Analysis
Phoenix AZ (USA)
14/10/2012 to 18/10/2012
SMTA international 2012
The Surface Mount Technology Association, developing solutions in Electronics Assembly
Orlando FL (USA)
01/10/2012 to 05/10/2012
ESREF 2012 / ISROS 2012
23rd European Symposium on Reliability of Electron Devices,Failure Physics and Analysis with:3rd International Symposium on Reliability of Optoelectronics For Space (ISROS 2012)
Cagliari (ITALIE)
10/07/2012 to 12/07/2012
SEMICON West 2012
Semicon West is your opportunity to connect with your customers, demonstrate your market leadership, and develop partnerships.
San Francisco (USA)
02/07/2012 to 06/07/2012
IPFA 2012
19th IEEE International Symposium on the physical and failure analysis of integrated circuits
Singapore
04/06/2012 to 08/06/2012
ANADEF Atelier 2012
Analyses et Mécanismes de défaillance des composants pour l'électronique
Seignosse (FRANCE)
03/06/2012 to 07/06/2012
ISPSD'2012
24th IEEE International Symposium on Power Semiconductor Devices and ICs
Bruges (BELGIUM)
29/05/2012 to 01/06/2012
ECTC 2012
The Premier international packaging, components, and microelectronic systems technology conference
San Diego (USA)
08/05/2012 to 10/05/2012
SMT/Hybrid/Packaging 2012 & PCIM 2012
SMT Hybrid Packaging is Europe´s
leading event on System Integration in
Micro Electronics.
Nuremberg (GERMANY)
24/04/2012 to 26/04/2012
SEMICON Singapore 2012
SEMICON Singapore is Southeast Asia's premier annual event dedicated to microelectronics manufacturing
Singapore
16/04/2012 to 18/04/2012
EUROSIME 2012
13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Lisbonne (PORTUGAL)
08/03/12
IMAPS journée technique: Fiabilité des composants et systèmes
IMAPS Technical Exhibition day
Journée technique « la Fiabilité du packaging des semiconducteurs »
Bordeaux
28/02/12 to 01/03/12
APEX-IPC 2012
Advanced and Emerging technologies in printed board design and manufacturing, electronics assembly and test
Booth N° 531
San Diego (USA)
01/02/2012 to 02/02/2012
IMAPS 2012
6th European Advanced Technology Workshop on Micropackaging and Thermal Management
La Rochelle (FRANCE)
November 13-17th
ISTFA 2011
The ISTFA technical symposia, user groups, education opportunities and the largest equipment exposition in the industry.
San Jose, California (USA)
October 20-21th
GIF Innovation 2011
For its third edition Grenoble Innovation Fair is broadening its scope to cover more new or emerging innovations in Europe.
Grenoble (FRANCE)
October 16-20th
SMTA International 2011
The Surface Mount Technology Association, developing solutions in Electronics Assembly
Fort Worth TX (USA)
October 3-6th
IWLPC 2011
International Wafer-Level Packaging Conference
Santa Clara CA (USA)
October 3-7th
Esref 2011
This international symposium continues to focus on recent developments and future directions in Quality and Reliability Management of materials.
Bordeaux (FRANCE)
July 12-14th
Semicon West 2011
Semicon West is your opportunity to connect with your customers, demonstrate your market leadership, and develop partnerships.
San Francisco (USA)
July 4-7th
IPFA 2011
IPFA 2011 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures.
South Korea
May 31st- June 3rd
ECTC 2011
Electronic Components and Technology Conference
Orlando FL (USA)
May 24-27th
Cofrend's days
Confédération Française pour les Essais Non Destructifs
Dunkerque (France)
May 11-13th
Semicon Singapore 2011
SEMICON Singapore is a series of informative forums simultaneously taking place right at the show floor where visitors can meet the industry leaders.
Singapore
May 11-12th
Minapad 2011
Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum
Grenoble
May 3rd
Imaps New England Packaging Symposium 2011
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems
Boxborough MA( USA)
May 3-5th
SMT/Hybrid/Packaging 2011
System Integration in Micro Electronics
Nuremberg (Germany)
April 17-20th
Eurosime 2011
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.
Linz (Austria)
April 10-14th
IPC-APEX 2011
Advanced and Emerging technologies in printed board design and manufacturing, electronics assembly and test
Las Vegas (USA)
April 6-7th
Decielec 2011
Convention d'affaires des systèmes embarqués Congrès international de l'électronique de puissance et du management des systèmes énergétiques
Tarbes (France)
March 8-10th
Imaps conference on DEVICE PACKAGING
7th International Conferrence and Exhibition on device Packaging
Fountain Hills (AZ, USA)
February 2-3rd
Imaps Micropackaging and Thermal MANAGEMENT 2011
This event has consistently attracted more presenters and delegates over the years. This is a real networking opportunity on thermal management of integrated circuits and electronic systems in Europe.
La Rochelle (France)
Exhibit News
> May 28 2013
ECTC 2013 Electronic Components and Technology Conference
> Jul 09 2013
SEMICON West 2013
> Sep 09 2013