03/09/2014 - 05/09/2014 SEMICON Taiwan 2014 SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. TWTC Nangang Exhibition Hall, Taipei City, TAIWAN
08/07/2014 - 10/07/2014 SEMICON West 2014 SEMICON West is the first global event for the micro- and nanoelectronics industry Moscone Center, San Francisco, USA
27/05/2014 - 30/05/2014 ECTC 2014 Electronic Components and Technology Conference Lake Buena Vista, Florida, USA
21/05/2014 MINaPAD Forum 2014 Conference & Exhibition "Bringing closer the design and the semiconductor assembly & packaging communities" - Paper Presentation Insidix "Coupling of emerging inspection techniques and thermo-mechanical modeling" CEA MINATEC - Booth N°19 - Grenoble - FRANCE
18/03/2014 - 20/03/2014 SEMICON China 2014 We are participating in Semicon Shanghai 2014 Show, Pls visit us at booth no. 4743 Hall N4 Shanghai - CHINE
03/12/2013 PC2A - GRENOBLE Journée Technique : VERNIS DE TROPICALISATION CCI de Grenoble - FRANCE
01/10/2013 - 04/10/2013 ESREF 2013 24th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - stand 4 Arcachon - FRANCE
09/09/2013 - 12/09/2013 EMPC 2013 European Microelectronics and Packaging Conference - Paper "Coupling experimental and modelling results for device failure anticipation"- Booth Grenoble FRANCE
09/07/2013 - 11/07/2013 SEMICON West 2013 Moscone Center San Francisco USA
19/03/2013 - 21/03/2013 SEMICON China 2013 Shanghai China
February 6 & 7, 2013 IMAPS 2013 8th European Advanced Technology Workshop on Micropackaging and Thermal management La Rochelle France
30/01/2013 - 01/02/2013 SEMICON Korea 2013 COEX Seoul Korea
05/12/2012 to 07/12/2012 SEMICON Japan The World Largest Exhibition for The Semiconductor Manufacturing Supply Chain Tokyo (JAPAN)
Nov 28_29 2012 15th Technical & Scientific Meeting of ARCIS Characterization methods for Microelectronics and Photovoltaics Gardanne - France
11/11/2012 to 15/11/2012 ISTFA 2012 38th International Symposium for Testing and Failure Analysis Phoenix AZ (USA)
14/10/2012 to 18/10/2012 SMTA international 2012 The Surface Mount Technology Association, developing solutions in Electronics Assembly Orlando FL (USA)
01/10/2012 to 05/10/2012 ESREF 2012 / ISROS 2012 23rd European Symposium on Reliability of Electron Devices,Failure Physics and Analysis with:3rd International Symposium on Reliability of Optoelectronics For Space (ISROS 2012) Cagliari (ITALIE)
05/09/2012 to 07/09/2012 SEMICON Taiwan 2012 A Vibrant Semiconductor Market Taipei TAIWAN
10/07/2012 to 12/07/2012 SEMICON West 2012 Semicon West is your opportunity to connect with your customers, demonstrate your market leadership, and develop partnerships. San Francisco (USA)
02/07/2012 to 06/07/2012 IPFA 2012 19th IEEE International Symposium on the physical and failure analysis of integrated circuits Singapore
04/06/2012 to 08/06/2012 ANADEF Atelier 2012 Analyses et Mécanismes de défaillance des composants pour l'électronique Seignosse (FRANCE)
03/06/2012 to 07/06/2012 ISPSD'2012 24th IEEE International Symposium on Power Semiconductor Devices and ICs Bruges (BELGIUM)
29/05/2012 to 01/06/2012 ECTC 2012 The Premier international packaging, components, and microelectronic systems technology conference San Diego (USA)
08/05/2012 to 10/05/2012 SMT/Hybrid/Packaging 2012 & PCIM 2012 SMT Hybrid Packaging is Europe´s leading event on System Integration in Micro Electronics. Nuremberg (GERMANY)
24/04/2012 to 26/04/2012 SEMICON Singapore 2012 SEMICON Singapore is Southeast Asia's premier annual event dedicated to microelectronics manufacturing Singapore
16/04/2012 to 18/04/2012 EUROSIME 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Lisbonne (PORTUGAL)
08/03/12 IMAPS journée technique: Fiabilité des composants et systèmes IMAPS Technical Exhibition day Journée technique « la Fiabilité du packaging des semiconducteurs » Bordeaux
28/02/12 to 01/03/12 APEX-IPC 2012 Advanced and Emerging technologies in printed board design and manufacturing, electronics assembly and test Booth N° 531 San Diego (USA)
01/02/2012 to 02/02/2012 IMAPS 2012 6th European Advanced Technology Workshop on Micropackaging and Thermal Management La Rochelle (FRANCE)
November 28th to December 01st Rayons X et Matière Tours
November 28th and 29th Workshop "Challenges for 3D ICs and Systems" Toulouse
November 13-17th ISTFA 2011 The ISTFA technical symposia, user groups, education opportunities and the largest equipment exposition in the industry. San Jose, California (USA)
October 20-21th GIF Innovation 2011 For its third edition Grenoble Innovation Fair is broadening its scope to cover more new or emerging innovations in Europe. Grenoble (FRANCE)
October 16-20th SMTA International 2011 The Surface Mount Technology Association, developing solutions in Electronics Assembly Fort Worth TX (USA)
October 3-6th IWLPC 2011 International Wafer-Level Packaging Conference Santa Clara CA (USA)
October 3-7th Esref 2011 This international symposium continues to focus on recent developments and future directions in Quality and Reliability Management of materials. Bordeaux (FRANCE)
July 12-14th Semicon West 2011 Semicon West is your opportunity to connect with your customers, demonstrate your market leadership, and develop partnerships. San Francisco (USA)
July 4-7th IPFA 2011 IPFA 2011 will be devoted to the fundamental understanding of the physical mechanisms of semiconductor device failures. South Korea
May 31st- June 3rd ECTC 2011 Electronic Components and Technology Conference Orlando FL (USA)
May 24-27th Cofrend's days Confédération Française pour les Essais Non Destructifs Dunkerque (France)
May 11-13th Semicon Singapore 2011 SEMICON Singapore is a series of informative forums simultaneously taking place right at the show floor where visitors can meet the industry leaders. Singapore
May 11-12th Minapad 2011 Micro/Nano-Electronics Packaging and Assembly, Design and Manufacturing Forum Grenoble
May 3rd Imaps New England Packaging Symposium 2011 Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nanoelectronics and Systems Boxborough MA( USA)
May 3-5th SMT/Hybrid/Packaging 2011 System Integration in Micro Electronics Nuremberg (Germany)
April 17-20th Eurosime 2011 International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Linz (Austria)
April 10-14th IPC-APEX 2011 Advanced and Emerging technologies in printed board design and manufacturing, electronics assembly and test Las Vegas (USA)
April 6-7th Decielec 2011 Convention d'affaires des systèmes embarqués Congrès international de l'électronique de puissance et du management des systèmes énergétiques Tarbes (France)
March 8-10th Imaps conference on DEVICE PACKAGING 7th International Conferrence and Exhibition on device Packaging Fountain Hills (AZ, USA)
February 2-3rd Imaps Micropackaging and Thermal MANAGEMENT 2011 This event has consistently attracted more presenters and delegates over the years. This is a real networking opportunity on thermal management of integrated circuits and electronic systems in Europe. La Rochelle (France)
ECTC 2013 Electronic Components and Technology Conference